探針座/探針卡方案
• Applications
1. Temperature characteristics tests in range from +20℃to +300℃
2. Ultra low signal I=-V measurements (100fA level)
3. Various C-V measurements (quasi-static C-V, HF-CV, and RF-CV)
4. RF measurements (up to 67GHz)
5. Ultra high-speed I-V measurements
• Extend Application
1. High-power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)
2. Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)
3. Probe card support (support Multi-siteWLR)
4. Built-in laser cutter(Point making, Exfoliation of protection layer, Metal layer cutting)
5. Active vibration isolator and ultra high-accuracy probing through image processing pattern recognition (accuracy: ±1 um or finer)
6. Light-receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)
7. Common gate pad contacts of flat-panel display devices
針對On-wafer 測試，克達科技提供您完整測試方案從手動、半自動到全自動等，探針/探針卡全面性的解決方案
1. Manual
2. Semi-Auto
3. Fully-Auto
1. Temperature characteristics tests in range from +20℃to +300℃
2. Ultra low signal I=-V measurements (100fA level)
3. Various C-V measurements (quasi-static C-V, HF-CV, and RF-CV)
4. RF measurements (up to 67GHz)
5. Ultra high-speed I-V measurements
• Extend Application
1. High-power device measurements (200A pulse, ±3kV triaxial, ±10kV coaxial)
2. Wafer level reliability tests (such as EM, TDDB, HCI, NBTI, and BT)
3. Probe card support (support Multi-siteWLR)
4. Built-in laser cutter(Point making, Exfoliation of protection layer, Metal layer cutting)
5. Active vibration isolator and ultra high-accuracy probing through image processing pattern recognition (accuracy: ±1 um or finer)
6. Light-receiving/emitting characteristics evaluation applications for optoelectronics (such as LED, LD, VCSEL, and PD)
7. Common gate pad contacts of flat-panel display devices
針對On-wafer 測試，克達科技提供您完整測試方案從手動、半自動到全自動等，探針/探針卡全面性的解決方案
1. Manual
2. Semi-Auto
3. Fully-Auto
